SW-8400ⅢDF / SW-12400ⅢDF for Silicon Wafers
SW-8400ⅢDF / SW-12400ⅢDF
for Silicon Wafers
SW series is an outgas collector from Silicon Wafer samples.
Features
SW-8400III is designed for 6 inch or 8 inch and SW-12400III is designed for 12 inch silicon wafer to collect surface outgas in the quartz oven with elevated temperature.
Outgas collection by sample tube reduces internal dead volume and enables trace analysis.
The wafer can be inserted or removed with ease by the built-in hydraulic pump.
Able to collect outgas only from surface side, whilst outgas from backside is discharged completely by vacuum pump.
Able to collect outgas at maximum temp. at 500°C. (when baking)
Touch panel offers intuitive and clean display
VOC are collected in the adsorption tube called PAT that has 10 mL internal volume and Tenax GR packed.
Adsorption tubes from other manufacturers are also possible to use (option).
Safety system is installed such as overheat prevention sensor, safety interlock, Emergency stop and leak sensor (option).
Multi-step temperature, split sampling, sample tube cooler when sampling are available as option.
SW series to collect outgas from silicon wafer samples.
Features
SW-8400III is designed for 6 inch or 8 inch and SW-12400III is designed for 12 inch silicon wafer to collect surface outgas in the quartz oven with elevated temperature.
Outgas collection by sample tube reduces internal dead volume and enables trace analysis.
The wafer can be inserted or removed with ease by the built-in hydraulic pump.
Able to collect outgas only from surface side, whilst outgas from backside is discharged completely by vacuum pump.
Able to collect outgas at maximum temp. at 500°C. (when baking)
Touch panel offers intuitive and clean display
VOC are collected in the adsorption tube called PAT that has 10 mL internal volume and Tenax GR packed.
Adsorption tubes from other manufacturers are also possible to use (option).
Safety system is installed such as overheat prevention sensor, safety interlock, Emergency stop and leak sensor (option).
Multi-step temperature, split sampling, sample tube cooler when sampling are available as option.
Cover the surface of silicon wafer by specially designed plate and collect outgas only from its surface. Pre-heated purge gas runs along the perimeter of the plate and leads the gas from the surface run into the center. By vacuum pump, it enables to collect outgas only from the surface side, whilst outgas from backside is discharged completely.
－Oven－
Cover the surface of silicon wafer by specially designed plate and collect outgas only from its surface. Pre-heated purge gas runs along the perimeter of the plate and leads the gas from the surface run into the center. By vacuum pump, it enables to collect outgas only from the surface side, whilst outgas from backside is discharged completely.
Specifications
Specifications
| SW-8400ⅢDF/ SW-12400ⅢDF | |
| Sampling method | Hat shaped collecting method |
| Sample size | Wafer size: 6 inch and 8 inch (SW-8400) and 12 inch (SW-12400) Smaller size than 5 inch, JAI offers a special jig. Bigger size than 12 inch, please ask. |
| Oven material | Stainless SUS316L |
| Oven heating | Surface and Bottom Individual heating method |
| Heating temp. | Max 400°C (up to 500°C for baking) |
| Cooling | Cooling water circulation |
| Heater pipe | Inside inert treated |
| Purge gas | N2 or He for general use, Flow rate up to 500 mL/min |
| PAT cooling unit (option) | Electronic cooling |
| Emergency stop | Available |
| Safety system | Safety interlock system |
| Oven open and close | Motor drive |
| Dimensions | 1140(W) x 1106(H) x 750(D) mm |
| Power supply | Single phase AC200V, 20A AC200V, 30A |
| Weight | 280Kg |
| SW-8400ⅢDF/ SW-12400ⅢDF | |
| Sampling method | Hat shaped collecting method |
| Sample size | Wafer size: 6 inch and 8 inch (SW-8400) and 12 inch (SW-12400) Smaller size than 5”, JAI offers a special jig. Bigger size than 12 inch, please ask. |
| Oven material | Stainless SUS316L |
| Oven heating | Surface and Bottom Individual heating method |
| Heating temp. | Max 400°C (up to 500°C for baking) |
| Cooling | Cooling water circulation |
| Heater pipe | Inside inert treated |
| Purge gas | N2 or He for general use, Flow rate up to 500 mL/min |
| PAT cooling unit (option) | Electronic cooling |
| Emergency stop | Available |
| Safety system | Safety interlock system |
| Oven open and close | Motor drive |
| Dimensions | 1140(W) x 1106(H) x 750(D) mm |
| Power | Single phase AC200V, 20A AC200V, 30A |
| Weight | 280 Kg |
